All Products
Keywords [ pcb manufacturing assembly ] match 383 products.
Small Hole Size Multi Layer Printed Circuit Board Production High Density
Surface Finish: | HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc. |
---|---|
Board Thickness: | 0.2-3.2mm |
Impedance Control: | Yes |
High TG FR4 Multi Level Printed Circuit Board Fabrication For Various Layer Counts
Layer Count: | 2-20 |
---|---|
Min. Hole Size: | 0.2mm |
Min. Line Width: | 0.1mm |
FR4 Printed Circuit Board With Green Solder Mask For Electronics
Assembly Service: | Yes |
---|---|
Min Hole Size: | 0.2mm |
Min Line Width: | 0.1mm |
Black Immersion Silver 6-Layer Multi-Layer Circuit Board For CCTV Camera
Surface Finish: | Immersion Silver |
---|---|
Board Thickness: | 2.0mm |
Impedance Control: | Yes |
High Performance Multilayer Printed Circuit Board With Gold Plating
Surface Finishing: | HASL, OSP, ENIG, Immersion Silver, Gold Plating |
---|---|
Minimum Hole Size: | 0.2mm |
Minimum Line Width/Spacing: | 3/3mil |
2 Layer Circuit Board Green Oil White Copper Thick 1OZ FR4 Board
Min Line Width/Space: | 0.1mm/0.1mm |
---|---|
Product Name: | Prototype PCB Assembly |
Surface Finish: | HASL |
4 Layer Circuit Board Green Oil White Characters Immersed Gold Finger Board
Components Type: | BGA, QFN, SOP, PLCC, SOIC, Etc. |
---|---|
Components Height: | 0.2mm-25.0mm |
Testing: | Flying Probe Test, X-Ray Inspection, AOI, Etc. |
Green Oil White 8-Layer Circuit Board Copper Thick 2OZ Rogers 5880 Base Material
Testing: | Flying Probe Test, X-Ray Inspection, AOI, Etc. |
---|---|
Components Orientation: | ±0.02mm |
Surface Finish: | HASL, ENIG, OSP, Immersion Gold, Etc. |
2 Layer Circuit Board Processing PCBA Electronic Materials Welding Contract Work And Materials
Components Placement: | ±0.02mm |
---|---|
Lead Time: | 7-10 Days |
Components Orientation: | ±0.02mm |
1oz copper thick circuit board multilayer board processing
Copper Thickness: | 1oz |
---|---|
Min Line Width: | 0.1mm |
Layer: | 2 |