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3 Layer HDI Double Sided PCB Board Circuit Board Multilayer ISO9001
Place of Origin | Guangdong, China |
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Brand Name | JIETENG |
Certification | ISO/TS16949/RoHS/TS16949 |
Model Number | PCBA |
Minimum Order Quantity | Negotiable |
Price | Negotiable |
Packaging Details | Inner vacuum packed outer standard carton |
Delivery Time | 5-8days for delivery |
Payment Terms | Negotiable |
Supply Ability | 10000 Piece/Pieces per Week |

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xProduct Details
Copper Thickness | 1 Oz, 0.5 Oz ~ 7.0 Oz | Min. Hole Size | 0.20 Mm |
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Board Thickness | 0.35mm ~ 7.0mm | Min. Line Spacing | 0.075mm |
Base Material | FR-4 | ||
Highlight | ISO9001 HDI double sided pcb board,ISO9001 FR4 double sided pcb board,HDI 3 layer pcb |
Product Description
Mobile Phone Power Motherboard HDI circuit board multi-layer arbitrary level circuit board
Essential details
Item | Mass Production |
Max Stencil Size | 1560mm*450mm |
Min SMT Package | 0201 |
Min IC Pitch | 0.3mm |
Max PCB Size | 1200mm*400mm |
Min PCB Thickness | 0.35mm |
Min Chip Size | 001005 |
Max BGA Size | 74mm*74mm |
BGA Ball Pitch | 1.0-3.00 |
BGA Ball Diameter | 0.2 - 1.0mm |
QFP Lead Pitch | 0.2mm-2.54mm |
SMT Capacity | 2 million points per day |
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