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OSP Multilayer Printed Circuit Board Board Thickness 0.4-3.2mm Copper Thickness 1-6oz

Minimum Line Width/Spacing: 3/3mil
Surface Finishing: HASL, OSP, ENIG, Immersion Silver, Gold Plating
Payment Term: T/T, PayPal, Western Union
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Board Size: Up To 500mm X 500mm
Manufacturing Process: Surface Mount Technology (SMT)
Components Orientation: ±0.02mm
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Component Pitch: 0.2mm-5.0mm
Board Thickness: 0.4mm-4.0mm
Components: Passive And Active Components
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Red Solder Mask Multi-Layer PCB Manufacturing With 0.2-3.2mm Board Thickness

Board Thickness: 0.2-3.2mm
Min. Hole Size: 0.2mm
Min. Line Spacing: 0.1mm
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Min. Line Width: 0.1mm
Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.
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HASL Prototype PCB Assembly with 1.6mm PCB Thickness and Min Solder Mask Bridge 0.1mm

Min Solder Mask Bridge: 0.1mm
Silkscreen Color: White
Test Method: Flying Probe Test
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Tin-Sprayed PCB Circuit Board With White Silk Screen Printing And Flying Probe Testing

Material: FR4
Test: Flying Probe Test
Solder Mask Color: Green
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High Frequency Hybrid Circuit Board FR4 + Rogers Material 2.0 Plate Thickness Surface Immersion Gold

Min. Hole Size: 0.25mm
Board Thickness: 1.6mm
Silkscreen Color: White
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Silkscreen Color: White
Min Solder Mask Bridge: 0.1mm
PCB Thickness: 1.6mm
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Min. Hole Size: 0.2mm
Product Name: PCB Board Assembly
Board Thickness: 0.2mm-3.2mm
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