All Products
Contact Person :
Sales Manager
Phone Number :
13510910864
Whatsapp :
+8613360524484
Precise SMT Assembly Service for BGA QFN Components Board 0.4mm-4.0mm
Component Pitch: | 0.2mm-5.0mm |
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Components: | Passive And Active Components |
Product Name: | SMT Assembly Service |
Customized PCB circuit board 6-layer board purple ink inside and outside 2OZ copper thickness
Components: | Passive And Active Components |
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Board Size: | Up To 500mm X 500mm |
Components Height: | 0.2mm-25.0mm |
SMT Assembly Service Up To 500mm X 500mm Board Size with Components and Testing
Board Size: | Up To 500mm X 500mm |
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Manufacturing Process: | Surface Mount Technology (SMT) |
Components Orientation: | ±0.02mm |
Green Oil White 8-Layer Circuit Board Copper Thick 2OZ Rogers 5880 Base Material
Testing: | Flying Probe Test, X-Ray Inspection, AOI, Etc. |
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Components Orientation: | ±0.02mm |
Surface Finish: | HASL, ENIG, OSP, Immersion Gold, Etc. |
1.6MM Thickness 6-Layer PCB Board Immersion Gold Surface Treatment
Testing: | Flying Probe Test, X-Ray Inspection, AOI, Etc. |
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Components Orientation: | ±0.02mm |
Components Size: | 01005-5050 |
4 Layer Circuit Board Green Oil White Characters Immersed Gold Finger Board
Components Type: | BGA, QFN, SOP, PLCC, SOIC, Etc. |
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Components Height: | 0.2mm-25.0mm |
Testing: | Flying Probe Test, X-Ray Inspection, AOI, Etc. |
Surface Mount Technology Assembly Service With Components Height 0.2mm-25.0mm
Components Height: | 0.2mm-25.0mm |
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Components Placement: | ±0.02mm |
Manufacturing Process: | Surface Mount Technology (SMT) |
2 Layer Circuit Board Processing PCBA Electronic Materials Welding Contract Work And Materials
Components Placement: | ±0.02mm |
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Lead Time: | 7-10 Days |
Components Orientation: | ±0.02mm |
6 Layer PCB Circuit Board Gold Finger Immersion Gold Process Cross Blind And Buried Holes
Lead Time: | 7-10 Days |
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Board Thickness: | 0.4mm-4.0mm |
Components Size: | 01005-5050 |
Professional Surface Mount Assembly Facility Service For Passive And Active Components
Components Type: | BGA, QFN, SOP, PLCC, SOIC, Etc. |
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Components Height: | 0.2mm-25.0mm |
Board Thickness: | 0.4mm-4.0mm |