6L 2OZ Multilayer Printed Circuit Board , FR4 TG150 6 Layers Pcb Green Solder Mask
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|Board Thickness||0.2mm-4.5mm||Copper Thickness||1OZ|
|Base Material||FR-4||Surface Finishing||HASL, ENIG, OSP, HASL Lead Free, Immersion Gold|
|Number Of Layers||6 Layer||Maximum PCB Size||1200x 500mm|
FR4 TG150 Multilayer Printed Circuit Board,
6L Multilayer Printed Circuit Board,
Green Solder Mask 6 Layers Pcb
6L 2OZ Multilayer Printed Circuit Board FR4 TG150 6 Layers Pcb Green Solder Mask
A 6L 2OZ multilayer printed circuit board (PCB) refers to a PCB with six layers of substrate material and copper traces, where the outer copper layers have a thickness of 2oz. The thicker copper layers provide better heat dissipation, which makes such PCBs suitable for high-current applications.
FR4 TG150 is a type of substrate material commonly used in the manufacturing of PCBs. It has a glass transition temperature (Tg) of 150°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. This makes it suitable for use in high-temperature applications.
A green solder mask is a type of surface finish that is applied to the copper traces and pads on the surface of the PCB. It provides protection against oxidation and other forms of corrosion, and it also helps prevent solder bridging during assembly.
a 6L 2OZ multilayer printed circuit board with FR4 TG150 material and green solder mask is a high-performance PCB suitable for a wide range of applications, including high-current and high-temperature applications. The specific capabilities and specifications of the PCB would depend on the manufacturer and the specific requirements of the application.
|Minimum IC Pitch '||0.2mm|
|Maximum PCB size||1200x 500mm|
|Minimum PCB thickness||0.25mm|
|Minimum chip size||0201 (0.2x0.1)/0603 (0.6 x 0.3mm)|
|Maximum BGA size||74x74mm|
|BGA ball pitch||1.00mm (minimum), 3.00mm (maximum)|
|BGA ball diameter||0.40mm (minimum), 1.00mm (maximum)|
|QFP lead pitch||0.38mm (minimum), 2.54mm (maximum)|
|Volume||One piece to low volume production quantities Low cost first article builds Schedule deliveries|
|Assembly type||Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly|
|Components type||Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch|
|Parts procurements||Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest|
|Solder type||Leaded Lead-free/ROHS compliant|
Shenzhen Jieteng Circuit Co., Ltd. is a professional circuit board manufacturer. The company has been in the PCB manufacturing industry for many years in the production of high quality PCBs for a wide range of applications