6L 2OZ Multilayer Printed Circuit Board , FR4 TG150 6 Layers Pcb Green Solder Mask

Place of Origin china
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number FR4
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Blank carton, vacuum packed
Delivery Time 5-8 working day
Payment Terms Negotiable
Supply Ability 150000 square meters / year

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Product Details
Board Thickness 0.2mm-4.5mm Copper Thickness 1OZ
Base Material FR-4 Surface Finishing HASL, ENIG, OSP, HASL Lead Free, Immersion Gold
Number Of Layers 6 Layer Maximum PCB Size 1200x 500mm
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FR4 TG150 Multilayer Printed Circuit Board


6L Multilayer Printed Circuit Board


Green Solder Mask 6 Layers Pcb

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Product Description

6L 2OZ Multilayer Printed Circuit Board FR4 TG150 6 Layers Pcb Green Solder Mask



A 6L 2OZ multilayer printed circuit board (PCB) refers to a PCB with six layers of substrate material and copper traces, where the outer copper layers have a thickness of 2oz. The thicker copper layers provide better heat dissipation, which makes such PCBs suitable for high-current applications.

FR4 TG150 is a type of substrate material commonly used in the manufacturing of PCBs. It has a glass transition temperature (Tg) of 150°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. This makes it suitable for use in high-temperature applications.

A green solder mask is a type of surface finish that is applied to the copper traces and pads on the surface of the PCB. It provides protection against oxidation and other forms of corrosion, and it also helps prevent solder bridging during assembly.

a 6L 2OZ multilayer printed circuit board with FR4 TG150 material and green solder mask is a high-performance PCB suitable for a wide range of applications, including high-current and high-temperature applications. The specific capabilities and specifications of the PCB would depend on the manufacturer and the specific requirements of the application.


Stencil Size 736x736mm
Minimum IC Pitch ' 0.2mm
Maximum PCB size 1200x 500mm
Minimum PCB thickness 0.25mm
Minimum chip size 0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size 74x74mm
BGA ball pitch 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch 0.38mm (minimum), 2.54mm (maximum)
Volume One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type Leaded Lead-free/ROHS compliant



Shenzhen Jieteng Circuit Co., Ltd. is a professional circuit board manufacturer. The company has been in the PCB manufacturing industry for many years in the production of high quality PCBs for a wide range of applications