Customized Electronic Circuit Board Assembly , PCBA Manufacturer Single Sided PCB
Place of Origin | Guangdong, China |
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Brand Name | JIETENG |
Certification | ISO/TS16949/RoHS/TS16949 |
Model Number | PCBA |
Minimum Order Quantity | Negotiable |
Price | Negotiable |
Packaging Details | Inner vacuum packing, outer standard carton |
Delivery Time | 5-8 days for delivery |
Payment Terms | Negotiable |
Supply Ability | 150000 Square Meter/Square Meters per Year |
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Whatsapp:0086 18588475571
Wechat: 0086 18588475571
Skype: sales10@aixton.com
If you have any concern, we provide 24-hour online help.
xBase Material | FR4 ,Any Specialized Material As Per Your Choice | Copper Thickness | 0.3- 6OZ |
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Board Thickness | 0.3 Mm- 4 Mm | Min. Hole Diameter | 0.2 Mm |
Min. Line Width | 0.1 Mm | Min. Line Spacing | 0.1 Mm |
Highlight | FR4 Electronic Circuit Board Assembly,HASL Electronic Circuit Board Assembly,6OZ Single Sided PCB |
Customized Electronic Circuit Board Assembly PCBA Manufacturer Single-Sided PCB
If desired, we will source, organise and manage all aspects of the PCB design, so that your product meets all required standards and is fully optimised for easy and cost effective manufacturing. A well designed circuit board means: · A reduction in production problems · Improved quality control · Reduced costs · Reduced manufacturing times
Our advantage | ||
Material Technology | Our Production | General Production |
Regular/Special | 1. Our (TG170)FR4: high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2. Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3. Our CEM no-burr 4. Our Rogers Good performance in high frequency 5. Our Aluminum Excellent heat dispersion |
1.General FR4 High heat work 2.General CEM Expand and deform in damp conditions |
Factory | We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes surface brighter, cleaner and more smooth, and it helps reduce the cost. |
Artificial production line |
Blind/buried via board, High Density Interconnect(1+1,N+1) | Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design. | Difficult manufacturer, high cost |
Impedance | Good performance in reliability and stability of signal sending and receiving | High cost |
Surface Technics | 1. IMG:smooth surface, good adhesion, no oxidation under long using 2. gold plating(thick gold:1-50U"):good wear-resistance 3. HASL:better price, not easy oxidation, easy to welding, smooth surface 4. HAL: better price, not easy oxidation, easy to welding |
1.IMG:high price 2.Gold plating(thick gold):high price 3.HAL:surface is not flat, not suitable for BAG packaging |
Copper Via/Surface(20-25UM,0.5-60Z) | Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM | Hard to reach 0.1MM |
Multilayer board(4-20 L),BGA(CPU) | BGA: high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN width/space: 3/3MIL Multilayer board:strong microporous, high reliability |
Difficult manufacturer,high cost |
Test | To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework | Careless |