Industrial FR4 Multilayer Printed Circuit Board Prototype PCB Fabrication

Place of Origin Guangdong, China
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number PCBA
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Inner vacuum packing, outer standard carton
Delivery Time 5-8 days for delivery
Payment Terms Negotiable
Supply Ability 150000 Square Meter/Square Meters per Year

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Product Details
Board Thickness 1.6mm Min. Line Width 0.075mm
Number Of Layers 1-60L Material FR4
Usage Industry Control
High Light

Prototype Multilayer Printed Circuit Board

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FR4 Multilayer Printed Circuit Board

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Industrial prototype pcb fabrication

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Product Description

Factory direct multi-layer instrument circuit board industrial control equipment motherboard PCB circuit board

ssential details
Model Number:
PCB
Place of Origin:
Guangdong, China
Brand Name:
JIETENG 
Base Material:
FR4, Modified Epoxy, Polyimide, PTFE, Glass, FR4, Modified Epoxy, Polyimide, PTFE, Glass, AL, FPC
Copper Thickness:
0.5 OZ, 1 OZ, 1.5 OZ, 2 OZ, 3 OZ, 0.5 OZ, 1 OZ, 1.5 OZ, 2 OZ, 3 OZ
Board Thickness:
0.2-5.0 MM
Min. Hole Size:
0.1 MM
Min. Line Width:
0.075 MM
Min. Line Spacing:
0.075 MM
Surface Finishing:
OSP, HAL leadfree, ENIG, Immersion Tin etc., OSP, HAL leadfree, ENIG, Immersion Tin etc.
Name:
PCB Board Production
PCB Portfolio:
1-20 layers, Standard, HDI, High-TG, RF PCBs
Min. Component Size:
01005
Solder Mask Color:
Blue, Green, Red, Black, White.etc
IC Pakage:
DIP, SOP, SOJ, PLCC, QFP, QFN, BGA, POP etc
Service:
Prototype service, Material sourcing, PCB assembly, Conformal coating
Packaging Details:
Vacuum packing, Anti-static package (or in your requir
 

 

 

 

 

 

 

 

Type:
PCB & PCBA
Model Number:
Programming Board
PCB Portfolio:
1-20 layers, Standard, HDI, High-TG, RF PCBs
 
Service:
 
Prototype service, Material sourcing,
PCB assembly, Conformal coating,
Function test, Box build
Application:
Industrial, Automobile, Aviation, Medical, Electronics
PCB Portfolio:
1-20 layers, Standard, HDI, High-TG, RF PCBs
Base Material:
FR4, Modified Epoxy, Polyimide, PTFE, Glass, AL, FPC
Copper Thickness:
0.5 OZ, 1 OZ, 1.5 OZ, 2 OZ, 3 OZ
Board Thickness:
0.2-5.0 MM
Surface Finishing:
OSP, HAL leadfree, ENIG, Immersion Tin etc.
Solder Mask Color:
Blue, Green, Red, Black, White.etc
Min. Width/Space:
0.075 MM
Min. SM Bridge:
0.1 MM
Min. Hole Dia:
0.1 MM
Min. Component Size:
01005
Solder Printer Accuracy:
±25um
Multifunction Mounter Accuracy:
±30um
Impedance Control Tole ance:
±5%
Max. Stencial Size:
740 x 740 MM
IC Package:
DIP, SOP, SOJ, PLCC, QFP, QFN, BGA, POP etc
PCB Capacity:
55000 Square Meter/Month
SMT Capacity:
14 Million Chips/Day
DIP Capacity:
1.2 Million DIP Holes /Day
Packaging Details:
Vacuum packing, Anti-static package (or in your requirement)

 

Industrial FR4 Multilayer Printed Circuit Board Prototype PCB Fabrication 0