All Products
Contact Person :
Sales Manager
Phone Number :
13510910864
Whatsapp :
+8613360524484
0.2-3.2mm Board Thickness High Frequency PCBs With Bubble Bag Packaging
| Material: | FR4 |
|---|---|
| Packaging: | Vacuum Packing, Bubble Bag, Carton Box, Etc. |
| Board Thickness: | 0.2-3.2mm |
2-20 Layer Multi Layer PCB Manufacturing With 0.1mm Min. Line Spacing
| Silkscreen Color: | White, Black, Yellow, Etc. |
|---|---|
| Copper Thickness: | 1-4oz |
| Surface Finish: | HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc. |
Green Solder Mask Printed Circuit Board With 0.1mm Min Line Spacing
| Layer: | 2 |
|---|---|
| Surface Finish: | HASL |
| Solder Mask Color: | Green |
Green Solder Mask Color PCB SMT Assembly Equipped With 0.2mm Min. Hole Size
| Silk Screen Color: | White |
|---|---|
| Product Type: | PCB SMT Assembly |
| PCB Layer: | 2-Layer |
PCB Circuit Board 1.6 Board Thickness 4 Layer Board Motherboard Processing
| Min. Hole Size: | 0.2mm |
|---|---|
| Solder Mask Color: | Green |
| Test Type: | Flying Probe Test |
2 Layer Circuit Board Processing PCBA Electronic Materials Welding Contract Work And Materials
| Components Placement: | ±0.02mm |
|---|---|
| Lead Time: | 7-10 Days |
| Components Orientation: | ±0.02mm |
High Performance FR4 PCB Board With Surface Finish HASL And 0.1mm Min Line Width
| Layer: | 6 |
|---|---|
| Material: | FR4 |
| Board Thickness: | 1.6mm |
6 Layer PCB Circuit Board Gold Finger Immersion Gold Process Cross Blind And Buried Holes
| Lead Time: | 7-10 Days |
|---|---|
| Board Thickness: | 0.4mm-4.0mm |
| Components Size: | 01005-5050 |
8 Layer Impedance Plate Thick Copper Plate FR4 PCB Board Inside And Outside 6OZ
| Impedance Control: | Yes |
|---|---|
| Min Line Spacing: | 0.1mm |
| Surface Finish: | HASL |
FR4 Multilayer PCB Circuit Board Processing Minimum Hole 0.1 Laser Drilling
| Min Hole Size: | 0.2mm |
|---|---|
| Type: | PCB Board |
| Board Thickness: | 1.6mm |