Rogers OSP Multilayer Pcb Fabrication High Effective
|Place of Origin||China|
|Model Number||PCB circuit board|
|Minimum Order Quantity||Negotiable|
|Packaging Details||Blank carton, vacuum packed|
|Delivery Time||5-8 working day|
|Supply Ability||360000 square meters / year|
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|Min. Line Spacing||0.1mm||Solder Mask Color||Green, Blue, White, Black, Red, Etc.|
|Min. Hole Size||0.2mm||Impedance Control||Yes|
|Silkscreen Color||White, Black, Yellow, Etc.||Board Thickness||0.2-3.2mm|
|Min. Line Width||0.1mm||Layer Count||2-20|
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Multilayer PCB Fabrication is a comprehensive process for producing multi-layer printed circuit boards (PCBs). This process involves multiple layers of copper-clad laminate and other components, such as solder mask, soldermask, and surface finish. It is highly advanced and requires precise engineering and manufacturing processes for accurate results. The board thickness can range from 0.2mm to 3.2mm, depending on the application. The surface finish can be HASL, ENIG, OSP, immersion silver, immersion tin, and others. The minimum line width is 0.1mm, and the impedance control is available for more complex designs. Various solder mask colors are available, such as green, blue, white, black, and red. This multi-layer PCB fabrication process provides reliable and cost-effective solutions for creating multi-level printed wiring boards.
- Multi-Layer Printed Circuit Board Production: Min. Hole Size: 0.2mm, Layer Count: 2-20, Min. Line Spacing: 0.1mm, Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc., Impedance Control: Yes.
- Multi-Layer PCB Manufacturing: Min. Hole Size: 0.2mm, Layer Count: 2-20, Min. Line Spacing: 0.1mm, Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc., Impedance Control: Yes.
- Multi-Level Printed Circuit Board Fabrication: Min. Hole Size: 0.2mm, Layer Count: 2-20, Min. Line Spacing: 0.1mm, Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc., Impedance Control: Yes.
|Solder Mask Color||Green, Blue, White, Black, Red, Etc.|
|Silkscreen Color||White, Black, Yellow, Etc.|
|Min. Hole Size||0.2mm|
|Min. Line Spacing||0.1mm|
|Material||FR4, High TG FR4, Halogen Free, Rogers, Etc.|
|Min. Line Width||0.1mm|
|Surface Finish||HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.|
JTETENG Multi-Layer PCB Fabrication is the perfect choice for companies looking to create a multi-level printed wiring board. With our PCB circuit boards, you can create up to 20 layers of wiring and components. Our boards feature copper thickness of up to 4oz, and a minimum line width of 0.1mm, allowing for intricate designs. Impedance control is available for those looking to ensure precise signal pathways. Our silkscreen printing colors include white, black, yellow, and more. Our multi-layer PCB fabrication and component assembly services will help you build the perfect board for your purpose.
JTETENG offers professional Multi-Layer Printed Circuit Board (PCB) Fabrication services. Our Multi-Layer PCBs are designed for high performance, reliability and durability. We specialize in creating Multi-Level Printed Wiring Boards with the following specifications:
- Brand Name: JTETENG
- Model Number: PCB circuit board
- Place of Origin: China
- Board Thickness: 0.2-3.2mm
- Min. Line Spacing: 0.1mm
- Solder Mask Color: Green, Blue, White, Black, Red, Etc.
- Silkscreen Color: White, Black, Yellow, Etc.
- Min. Hole Size: 0.2mm
Multi-Level Printed Circuit Board Fabrication, Multi-Level Printed Wiring Board Creation and Multi-Layer PCB Component Assembly are just some of the services that JTETENG can provide. Contact us today for more information about our Multi-Layer PCB Fabrication services.
Support and Services:
We offer technical support and services for Multilayer PCB Fabrication. Our team of experts can assist you in all aspects of the production process, from design and engineering to full-scale fabrication.
Our team of professionals is dedicated to delivering high-quality designs and products that meet and exceed industry standards. We specialize in producing multilayer PCBs with complex circuitry, and our experience in this field has enabled us to provide customers with reliable, cost-effective solutions.
We provide technical assistance in the form of consultation and troubleshooting services to ensure successful completion of your project. Our team is available to answer any questions you may have and provide detailed information about the fabrication process.
We also provide on-site fabrication services, including installation, maintenance, and repair. Our technicians are experienced in the latest technologies and can provide the highest level of service for your project.
Contact us today for more information about our Multilayer PCB Fabrication Technical Support and Services.
Packing and Shipping:
Multilayer PCBs should be packaged and shipped properly to ensure their safe arrival at their destination. Packaging should be designed to protect the product from dust, moisture, and other external factors. All components should be securely packaged and labeled to ensure proper identification and handling.
Suitable packaging materials should be used to reduce the risk of damage during shipping. The package should be designed to withstand any rough handling that may occur during shipment. All packages should be clearly marked to indicate their contents and destination.
When shipping Multilayer PCBs, they should be shipped via reliable carriers that specialize in electronic shipments. All packages should be tracked to ensure they reach their destination safely and on time. All Multilayer PCBs should be stored in a temperature-controlled environment until they are ready to be shipped.