Multi Layer PCB Manufacturing With 0.1mm Min. Line Spacing 0.2mm Min. Hole Size

Product Description:

Multilayer PCB Fabrication, which is the creation of multi-level printed wiring boards, is a complex process that requires precision and expertise. Our experienced professionals specialize in multi-layer printed circuit board production and ensure that every step of the process is completed with the utmost care and attention to detail. Our multi-layer printed circuit board production services include a minimum line width of 0.1mm, copper thickness of 1-4oz, silkscreen colors of white, black, yellow, and more, board thickness of 0.2-3.2mm, and layer counts of 2-20. We are committed to providing the highest quality service and products to meet the specific needs of our customers.

Features:

• Product Name: Multilayer PCB Fabrication
• Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
• Min. Hole Size: 0.2mm
• Solder Mask Color: Green, Blue, White, Black, Red, Etc.
• Min. Line Width: 0.1mm
• Board Thickness: 0.2-3.2mm
• Highlight: Multi-Layer PCB Manufacturing, Multi-Layer Printed Circuit Board Production

Technical Parameters:

Applications:

JIETENG multi-layer PCB fabrication is a great solution for complex and intricate electronics designs. It is capable of producing multi-level printed circuit boards with various specs for a wide range of applications. The brand name, model number, place of origin, min. line width, silkscreen color, min. line spacing, copper thickness, and surface finish are all customizable.

Multi-layer PCB fabrication consists of multi-level printed circuit board assembly and multi-layer PCB assembly. The multi-level printed circuit board assembly provides high density interconnects, which can be used to build complex electronic devices. The multi-layer PCB assembly is used for assembling components on the printed circuit board. It involves assembling components, such as chips and resistors, onto the printed circuit board.

JIETENG multi-layer PCB fabrication is suitable for applications such as automotive, medical, industrial, and consumer electronics. It is also suitable for applications where fast and reliable signals are needed, such as communications, military, and aerospace. With its min. line width of 0.1mm, min. line spacing of 0.1mm, copper thickness ranging from 1-4oz, and surface finish options such as HASL, ENIG, OSP, Immersion Silver, and Immersion Tin, JIETENG multi-layer PCB fabrication ensures high quality and precise components for various applications.

Moreover, the silkscreen color can be customized according to customer needs, from white, black, yellow, to other colors. With its versatile features, JIETENG multi-layer PCB fabrication is the perfect solution for creating complex and precise electronic devices.

Customization:

Support and Services:

We provide comprehensive support and service for Multilayer PCB Fabrication, including:

• Pre-production design support
• PCB layout optimization
• Prototyping
• Fabrication and assembly
• Reliability testing
• On-site technical support

For more information, please contact our technical support team.

Packing and Shipping:

The packaging and shipping of Multilayer PCB Fabrication involves the following steps:

• The PCBs are placed in an antistatic poly bag and then sealed.
• The sealed PCBs are then placed in an antistatic foam box.
• The box is then placed in a cardboard box and sealed.
• The cardboard box is then shipped to the customer.

FAQ: