Halogen Free Multilayer PCB Fabrication 0.1mm Min Line Spacing 0.2mm Min Hole Size

Product Description:

Multilayer PCB Fabrication is a production process of fabricating multi-layer printed circuit boards (PCBs). It involves the assembly of multi-layer components on a substrate material, such as FR4, high TG FR4, halogen free, rogers, etc. The production process is capable of producing min. line width of 0.1mm and min. line spacing of 0.1mm, with impedance control. Furthermore, the board thickness can be tailored from 0.2-3.2mm. The production process is suitable for high-complexity PCB designs, and is capable of providing high-precision and reliable multi-layer PCBs.

Features:

• Product Name: Multilayer PCB Fabrication
• Min. Line Spacing: 0.1mm
• Silkscreen Color: White, Black, Yellow, Etc.
• Solder Mask Color: Green, Blue, White, Black, Red, Etc.
• Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.
• Min. Line Width: 0.1mm
• Multi-Layer PCB Component Assembly
• Multi-Level Printed Circuit Board Fabrication
• Multi-Layer PCB Component Assembly
• Multi-Layer PCB Component Testing

Technical Parameters:

Applications:

The JTETENG multi-layer PCB fabrication offers a variety of components and materials that make it suitable for a wide range of applications. With a brand name of JTETENG, the PCB circuit board provides solder mask colors including green, blue, white, black, and red. The copper thickness is available from 1-4oz, and the material options include FR4, high TG FR4, Halogen-free, Rogers, and more. The board thickness range is from 0.2-3.2mm, and layer count can be 2-20. Customers can have the option to choose from various components and materials to satisfy their needs.
JTETENG's multi-layer PCB fabrication is suitable for a wide range of applications. It is used for multi-level printed wiring board creation, multi-layer PCB component assembly, and multi-layer PCB component assembly. The PCB circuit board can also be used for automotive, medical, industrial control, and consumer electronics. It has excellent thermal, electrical, and mechanical properties, which make it an ideal choice for many applications.
The multi-layer PCB fabrication from JTETENG is a reliable and cost-effective solution for customers. With its wide range of components and materials, it is a perfect choice for various applications. The high level of quality assurance ensures that the PCB circuit boards are manufactured with precision and accuracy. The multi-layer PCB fabrication will provide customers with a reliable and cost-effective solution that is suitable for their needs.

Customization:

JTETENG is a leading provider of multi-layer printed circuit board fabrication services. With years of experience and expertise in this field, we are able to provide our customers with high quality and reliable products.
Our multi-level printed wiring board creation services include:

• Board Thickness: 0.2-3.2mm
• Min. Hole Size: 0.2mm
• Solder Mask Color: Green, Blue, White, Black, Red, Etc.
• Material: FR4, High TG FR4, Halogen Free, Rogers, Etc.
• Min. Line Width: 0.1mm

We have a highly experienced and skilled team that is dedicated to creating high quality multi-level printed wiring boards for our customers. Our team is also able to provide custom solutions to meet your specific needs.
At JTETENG, we strive to provide our customers with the highest quality multi-level printed circuit board fabrication services. Contact us today to find out more about our services.

Support and Services:

Multilayer PCB fabrication is a complex process and requires a great deal of expertise and experience. Our team of professional engineers and technicians has extensive experience in providing reliable, high-quality multilayer PCB fabrication services.
We offer a range of services to help ensure the success of your project, including:

• Design for manufacturing (DFM) consultation and guidance
• Prototype fabrication
• High-volume production
• Testing and troubleshooting
• Quality assurance

Our team is dedicated to providing the best possible service to ensure the highest quality outcome for your project. We strive to keep up with the latest advancements in technology to ensure our services are always up to date and efficient. We are committed to providing the best customer service and support to ensure your project is successful.

Packing and Shipping:

Multilayer PCB Fabrication is a delicate and complex process that requires careful packaging and shipping. To ensure that the product arrives in good condition, certain precautions should be taken when packaging and shipping.

The components and materials used in the Multilayer PCB Fabrication process must be properly secured and packaged in order to prevent damage during transit. All components should be wrapped in antistatic bags, and each component should be packed separately. All components should then be placed in a single box or container. The box or container should be securely sealed and labeled with the product name, destination, and other relevant information.

The box or container should then be shipped using a reliable carrier with tracking capabilities. Special care should be taken to ensure that the product is not exposed to extreme temperatures or moisture during transit. Additionally, the box should be clearly labeled with the product name, destination, and other relevant shipping information.

FAQ:

• Q1: What is the material of the PCB circuit board?
  A1: The PCB circuit board from JTETENG is made of high-quality multilayer material.
• Q2: What is the thickness of the multilayer PCB?
  A2: The multilayer PCB from JTETENG is 0.2mm-3.2mm.
• Q3: How long does the multilayer PCB fabrication process take?
  A3: It usually takes 5 to 10 days, depending on the complexity of the circuit board.
• Q4: What is the maximum size of the multilayer PCB board?
  A4: The maximum size of the multilayer PCB board from JTETENG is 500mm x 1200mm.
• Q5: What is the price range of the multilayer PCB fabrication?
  A5: The price range of the multilayer PCB fabrication from JTETENG varies, depending on the quantity and complexity.