Multilayer PCB Fabrication With 0.1mm Min Line Width And Impedance Control
|Place of Origin||China|
|Model Number||PCB circuit board|
|Minimum Order Quantity||Negotiable|
|Packaging Details||Inner vacuum packing, outer standard carton|
|Delivery Time||5-10 days for delivery|
|Supply Ability||100000 Square Meter/Square Meters per Year|
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|Min. Line Width||0.1mm||Layer Count||2-20|
|Copper Thickness||1-4oz||Board Thickness||0.2-3.2mm|
|Silkscreen Color||White, Black, Yellow, Etc.||Material||FR4, High TG FR4, Halogen Free, Rogers, Etc.|
|Solder Mask Color||Green, Blue, White, Black, Red, Etc.||Impedance Control||Yes|
Impedance Control Multilayer PCB Assembly,
0.1mm Multi Layer PCB Manufacturing
Multi-level printed circuit board fabrication is a specialized service offered by professional PCB manufacturers to create complex, multi-level printed wiring boards. This process includes the use of advanced equipment and techniques to produce intricate designs with high precision. It is necessary to achieve specific requirements such as solder mask colors, minimum line spacing, line widths, and hole sizes. The surface finish options available for multi-level printed wiring board creation include HASL, ENIG, OSP, immersion silver, and immersion tin, among others. Customers can also benefit from other advanced features such as blind via, buried via, impedance control, and impedance matching. All of these features, combined with the highest quality standards, ensure that the final product meets the customer’s exact specifications.
- Product Name: Multilayer PCB Fabrication
- Min. Line Width: 0.1mm
- Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
- Solder Mask Color: Green, Blue, White, Black, Red, Etc.
- Layer Count: 2-20
- Copper Thickness: 1-4oz
- Multi-Layer PCB Component Assembly
- Multi-Level Printed Circuit Board Fabrication
- Multi-Layer Printed Circuit Board Production
|Min. Line Spacing||0.1mm|
|Silkscreen Color||White, Black, Yellow, etc.|
|Min. Hole Size||0.2mm|
|Solder Mask Color||Green, Blue, White, Black, Red, etc.|
|Surface Finish||HASL, ENIG, OSP, Immersion Silver, Immersion Tin, etc.|
|Min. Line Width||0.1mm|
JTETENG multi-layer printed circuit board production offers superior quality and performance for the most demanding applications. Our multi-level printed circuit board fabrication services are perfect for a wide range of applications, from consumer electronics and automotive to medical and industrial. We provide a range of materials, including FR4, high TG FR4, halogen free, Rogers, and more. Our multi-layer printed circuit boards are capable of handling layer counts of 2-20 and have superior impedance control. We offer a variety of surface finishes including HASL, ENIG, OSP, immersion silver, and immersion tin. Our commitment to quality and service ensures that your multi-layer printed circuit boards will meet your exact specifications and exceed your expectations. With our comprehensive multi-layer printed circuit board production services, JTETENG is the ideal partner for all your PCB fabrication needs.
Brand Name: JTETENG
Model Number: PCB circuit board
Place of Origin: China
Copper Thickness: 1-4oz
Min. Line Spacing: 0.1mm
Impedance Control: Yes
Solder Mask Color: Green, Blue, White, Black, Red, Etc.
Board Thickness: 0.2-3.2mm
JTETENG has been a leading supplier of multi-layer printed circuit board production, multi-layer PCB component assembly, and multi-layer PCB manufacturing for more than 10 years. We provide quality PCBs with the highest precision and reliability.
Our multi-layer PCBs feature copper thicknesses from 1-4 oz, minimum line spacing of 0.1mm, impedance control, and solder mask colors in green, blue, white, black, and red, with board thicknesses from 0.2-3.2mm.
We are committed to providing excellent customer service and high-quality products, and we guarantee satisfaction with our multi-layer PCB fabrication services.
Support and Services:
We provide technical support and services for our customers in the areas of Multilayer PCB fabrication. Our experienced engineers are available to assist with design, fabrication, assembly and testing of your projects.
We are experienced in high density interconnect (HDI) fabrication and can assist in creating designs that meet your needs. We also specialize in complex multilayer fabrication, including blind and buried vias, impedance control and other special requirements.
Additionally, we offer full turn-key fabrication services, including full layout and design assistance, prototyping, production and assembly. We are committed to delivering high quality products in a timely manner.
If you have any questions or would like to discuss your project requirements, please contact us today.
Packing and Shipping:
Packaging and Shipping for Multilayer PCB Fabrication:
The products will be packed securely in antistatic bags and shipped in shock-proof boxes to ensure that the products are not damaged during transportation. Standard shipping insurance will be provided to cover any loss or damage during transit.
- Q1: What is Multilayer PCB Fabrication?
- A1: Multilayer PCB Fabrication is a process of constructing a printed circuit board (PCB) with multiple layers of conductive material that are interconnected with traces. It is provided by JTETENG, a brand name from China, with model number PCB circuit board.
- Q2: What is the benefit of using Multilayer PCB Fabrication?
- A2: Multilayer PCB Fabrication offers many benefits, including increased complexity, greater electrical performance, and improved signal integrity.
- Q3: What are the components of Multilayer PCB Fabrication?
- A3: The components of Multilayer PCB Fabrication include layers of conductive material, insulation, and traces.
- Q4: What is the process of Multilayer PCB Fabrication?
- A4: The process of Multilayer PCB Fabrication includes steps such as creating the PCB layout, drilling and plating, lamination, etching, and testing.
- Q5: What is the application of Multilayer PCB Fabrication?
- A5: The application of Multilayer PCB Fabrication includes computers, telecommunications, automotive electronics, medical devices, and consumer electronics.