FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

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xBase Material | FR-4 | Solder Mask | Black Green Blue |
---|---|---|---|
Material | Hight TG | Color | Green |
Plugging Vias Capability | 0.2-0.8mm | Special Requirements | Copper Filled Vias And Supplied Stack-up |
Highlight | TG180 Multilayer Printed Circuit Board,Green Multilayer Printed Circuit Board,FR4 PCB Board Assembly |
FR4 TG180 multilayer printed circuit board immersion gold process
FR4 TG180 is a special type of substrate material used in the manufacture of printed circuit boards (PCBs). It has a glass transition temperature (Tg) of 180°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. A multilayer PCB made with FR4 TG180 material refers to a PCB with more than two layers, usually 4 to 16 layers or more. The exact features and specifications of a multilayer FR4 TG180 PCB will depend on the manufacturer, but some common features may include:
Multilayer Count: Multilayer FR4 TG180 PCBs typically have more layers than single or two-layer PCBs, adding functionality and complexity.
High Heat Resistance: FR4 TG180 material has high heat resistance and is suitable for high temperature applications.
Tighter impedance control: Multilayer FR4 TG180 PCBs can have tighter impedance control, which is especially important for high-speed digital and RF applications.
High-frequency performance: FR4 TG180 material has good high-frequency performance and is suitable for occasions requiring high-speed signal transmission.
Smaller via sizes: Multilayer FR4 TG180 PCBs can use smaller via sizes, increasing density and reducing signal interference.
Overall, the multilayer FR4 TG180 PCB is a high performance PCB suitable for a wide range of applications where high temperature, high speed signal transmission and impedance control are important.
PCB Layer | Multilayer Printed Circuit board(12L) |
PCB surface finished | Immersion gold 2u" (0.05 - 0.1 µm gold over 3 - 5 µm of Nickel.) and gold finger |
PCB material requirement | FR4, TG180 |
PCB thickness finished | 2.2mm finished, +/-10% |
Smallest hole size | 0.20mm |
PCB solder resist | 2 sides, blue |
PCB silkscreen color | 2 sides, white |
Copper weigh of outer layer | 1 oz (35µm) Finished Copper Weight |
Copper weigh of inner layer | 1/2 oz (18µm) Base Weight |
Special requirements | Copper filled vias and supplied stack-up |
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