Copper Thickness 1OZ PCB Circuit Board , FR4 Material 6 Layer Board

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xBase Material | Fr4 | Copper Thickness | 2OZ |
---|---|---|---|
Min. Line Spacing | 0.1mm | Color | Blue |
Plugging Vias Capability | 0.2-0.8mm | Surface Finish/treatment | HALS/HALS Lead Free |
Highlight | HALS PCB Circuit Board,1OZ 6 Layer Board,FR4 6 Layer Board |
PCB circuit board 6-layer board FR4 material 1.6 board thickness copper thickness 1OZ
Our advantage
Professional rapid proofing and multi-variety batch expedited
The technology is mature and the warehouse is always stocked with various types of high-frequency high-speed sheet materials, high-frequency mixed-pressure sheet materials, halogen-free high TG sheet materials, thick copper and thick plates and other materials.
Mature production of various blind slots, back drilling, nickel-palladium gold, electro-thick gold, partial electro-gold + immersion gold, gold wire bonding, double-sided and multi-layer orders below 1.2 meters, etc.
Specification Of PCB Printed Circuit Board
1 | Layer | 1-30 layer |
2 | Material | FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2, Aluminum |
3 | Board thickness | 0.2mm-7mm |
4 | Max.finished board side | 500mm*500mm |
5 | Min.drilled hole size | 0.25mm |
6 | Min.line width | 0.075mm(3mil) |
7 | Min.line spaceing | 0.075mm(3mil) |
8 | Surface finish/treatment | HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing, Plastic bag |
12 | Outer packing | Standard carton packing |
13 | Hole tolerance | PTH:±0.076, NTPH:±0.05 |
14 | Certificate | UL, ISO9001, ISO14001, ROHS, CQC |
15 | Profiling Punching | Routing, V-CUT, Beveling |
16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
Shenzhen Jieteng Circuit Co., Ltd. has been focusing on the production of PCB circuit boards since 2009. The production process capacity can reach the production of 1-80 layer circuit boards. The surface treatment can be sprayed tin, immersion gold, anti-oxidation, etc.