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Fr4 Oxidation Resistance Processing PCB SMT Assembly Single And Double Panel

  • Fr4 Oxidation Resistance Processing PCB SMT Assembly Single And Double Panel
Place of Origin Guangdong, China
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number PCBA
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Inner vacuum packing, outer standard carton
Delivery Time 3-10 days for delivery
Payment Terms Negotiable
Supply Ability 150000 Square Meter/Square Meters per Year

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Product Details
Copper Thickness 1/2OZ 1OZ 2OZ 3OZ Base Material CEM3
Board Thickness 1.6mm-3.2mm Min. Line Width 0.1mm/4mi
Surface Finishing ENIG Product Name AC110V 220V Infared Led Pcb Board
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CEM3 PCB SMT Assembly

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Fr4 PCB SMT Assembly

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Oxidation Resistance Fr4 PCB
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Product Description

Fr -4 oxidation resistance fr -4 impedance manufacturer PCB processing single and double-panel PCB

Essential details
Model Number:
PCBA
Type:
home appliance pcba, consumer electronics pcba,medical pcba
Place of Origin:
Guangdong, China
Brand Name:
JIETENG
Supplier Type:
PCBA Manufacture and Pcba PCB assembly
Copper Thickness:
3 oz, 1OZ 2OZ 3OZ 4OZ 5OZ
Name:
SMT Electronic Components PCB Assembly Service
Application field:
Household Appliance; Medical Products; Consumer Electronics
Shape:
Rectangular,round,slots,cutouts,complex,irreguiar
PCBA service:
SMD SMT DIP Component Assembly
Keywords:
PCBA OEM PCB Assembly,Clone
Material:
FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum, Rogers, etc
PCB type:
High-difficulty multilayer, flexible, rigid-flexible
Certificate:
ISO9001/Iso14001/CE/ROHS
 

 

PCB Assembly Capability
Item
Capability
Advantages
----Professional Surface-mounting and Through-hole soldering technology
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.
Components
Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Quantity
Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized
Type of Assembly
SMT, Thru-hole
Solder Type
Water Soluble Solder Paste, Leaded and Lead-Free
Bare Board Size
Smallest:0.25*0.25 inches
Largest:20*20 inches
File Formate
Gerber files, Pick-N-Place file, Bill of Materials
Types of Service
Turn-key,partial turn-key or consignment
Component packaging
Cut Tape,Tube,Reels,Loose Parts
Turn Time
Same day service to 15 days service
Testing
Flying Probe Test,X-ray Inspection AOI Test
PCB assembly process
Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing
Tags:

smt printed circuit board

control pcb assembly

printed circuit assembly design