Ceramic CEM1 Mainboard High Frequency PCBs Flexible Circuit Board

Place of Origin Guangdong, China
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number Rogers FR4
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Vacuum packing in blank cartons
Delivery Time 5-8 days delivery
Payment Terms Negotiable
Supply Ability 150000 Square Meter/Square Meters per Year

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Product Details
Layer 1-32 Layers Min.Line Width 4mil
Brand Name PCB Surface Finish Gold Plating
Min.Hole Diameter 0.20mm Soldermask Green
High Light

High Frequency PCBs

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Ceramic CEM1 CEM1 High Frequency PCBs

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CEM1 flexible circuit board

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Product Description

High Frequency PCBs Main Board processing of medical instrument

Essential details
Type:
PCB Assembly
Place of Origin:
Guangdong, China
Brand Name:
PCB
Material:
FR4 /aluminum/ceramic CEM1
Customized:
OEM & ODM
Sample time:
24/48/96hours
PCB standard:
IPC-A-610
Testing Service:
100% AOI Testing
Product name:
Pcb Board Assembly
Certificate:
ROSH,ISO9001
Layer:
1-24layers

 

 

 

 

 

 

 

 

FR-4 Process capability
NO Item Craft Ability
1 Surface Finish HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2 Layer 1-24 layers
3 Min.Line Width 4mil
4 Min.Line Space 4mil
5 Min.Space between Pad to Pad 3mil
6 Min.Hole Diameter 0.20mm
7 Min.Bonding Pad Diameter 0.20mm
8 Max.Proportion of Drilling Hole and Board Thickness 1:10
9 Max.Size of Finish Board 23inch*35inch
10 Rang of Finish Board′s Thickness 0.21-3.2mm
11 Min.Thickness of Soldermask 10um
12 Soldermask Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
13 Min.Linewidth of Idents 4mil
14 Min.Height of Idents 25mil
15 Color of Silk-screen White,Yellow,Black
16 Date File Format Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
17 E-testing 100%E-Test:High Voltage Testing
18 Material for PCB High TG Material:High Frequence ROGERS,TEFLON,TADONIC,ARLON(Haloger free Material)
19 E-testing Impedance Testing,Resisitance Testing,Microsection etc
20 Special Technological Requirement Blind&Buried Vias and High Thickness Copper

 

Ceramic CEM1 Mainboard High Frequency PCBs Flexible Circuit Board 0