High Density Interconnect PCB SMT Assembly Audio Circuit Board for Card Reader

Place of Origin Guangdong, China
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number HDI PCB
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Inner packing: vacuum bag Outer packing: carton
Delivery Time 5-10 days for delivery
Payment Terms Negotiable
Supply Ability 20000 Square Meter/Square Meters per Month

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Product Details
Base Material FR-4 Min. Line Spacing 0.1mm4mil)
Board Thickness 1.6mm-3.2mm Min. Hole Size 0.20mm
Surface Finishing ENIG Product Name Printed Circuit Board
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Card Reader PCB SMT Assembly

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High Density Interconnect PCB SMT Assembly

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High Density Interconnect audio circuit board

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Product Description

Intelligent card reader PCBA program to develop multi-layer high-frequency circuit board processing PCB circuit board

Essential details
Model Number:
HDI PCB
Type:
motherboard pcba
Place of Origin:
Liaoning, China
Brand Name:
JIETENG
Supplier Type:
ODM/OEM
Copper Thickness:
1 oz
Product name:
High Density Interconnect PCBs
Feature:
Technical specification
Number of layers:
4- 22 layers standard, 30 layers advanced
Materials:
FR4 standard,FR4 high performance,Halogen free FR4,Rogers
Copper weights (finished):
18μm-70μm
Minimum track and gap:
0.075mm / 0.075mm
PCB thickness:
0.40mm-3.20mm
Minimum mechanical drill:
0.15mm

 

 

Feature
Technical specification
Number of layers
4 – 22 layers standard, 30 layers advanced
Technology highlights
Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds
1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials
FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished)
18μm – 70μm
Minimum track and gap
0.075mm / 0.075mm
PCB thickness
0.40mm – 3.20mm
Maxmimum dimensions
610mm x 450mm; dependant upon laser drilling machine
Surface finishes available
OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill
0.15mm
Minimum laser drill
0.10mm standard, 0.075mm advanced

 

High Density Interconnect PCB SMT Assembly Audio Circuit Board for Card Reader 0