Aluminium Base High Frequency PCBs Board Fabrication Full Line 3oz

Place of Origin Guangdong, China
Brand Name JIETENG
Certification ISO/TS16949/RoHS/TS16949
Model Number Rogers
Minimum Order Quantity Negotiable
Price Negotiable
Packaging Details Vacuum packing in blank cartons
Delivery Time 5-8 days delivery
Payment Terms Negotiable
Supply Ability 150000 Square Meter/Square Meters per Year

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Product Details
Material FR4 Copper Thickness 1oz,2oz,3oz
Min. Hole Size 0.3mm Color Green
Silkscreen Color Silkscreen Color Min. Line Spacing 0.1mm
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Aluminium High Frequency PCBs

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3oz High Frequency PCBs

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3oz pcb board fabrication

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Product Description

High Quality Aluminium Base PCBs Full Line Double Sided Multi-Layers PCB

Essential details
Model Number:
PCB
Type:
consumer electronics pcba
Place of Origin:
Guangdong, China
Brand Name:
/
Supplier Type:
Shenzhen
Copper Thickness:
1 oz
Surface Finishing:
HASLOSPDOLD FingerENIGSolder MaskTin-Plating
Application:
Computer industry/communication industry/electronic industry
Service:
OEM/ODM
Solder mask color:
Green Oil
Min. Hole Size:
0.3mm
Layer:
1-16
Color:
Green
MOQ:
1 PCS
Min. Line Spacing:
0.1mm
Silkscreen Color:
White

 

 

 

 

 

 

 

 

 

 

 

 

PCB&PCBA Capacity
1
Material
FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc.
2
Board thickness
Mass production: 394mil(10mm) Samples: 17.5mm
3
Surface finish
HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
4
PCB Max panel size
1100mm × 610mm
5
Layer
Mass production: 1~16 layers / Pilot run: 16 layers, Flexible PCB: 1-12 Layers
6
Min hole size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7
PCBA QC
X-ray, AOI Test, Functional Test
8
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9
Our service
PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 16 layers
10
Sanforized
Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11
SMT Capacity
500Million Points/Day
12
DIP Capacity
0.3Million Points/Day
13
Certificate
RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485

 

Aluminium Base High Frequency PCBs Board Fabrication Full Line 3oz 0